{"id":59244,"date":"2019-03-28T21:06:38","date_gmt":"2019-03-28T20:06:38","guid":{"rendered":"https:\/\/tepcon.de\/networking-between-mechanical-engineering-and-computer-science\/"},"modified":"2019-03-28T21:06:38","modified_gmt":"2019-03-28T20:06:38","slug":"networking-between-mechanical-engineering-and-computer-science","status":"publish","type":"post","link":"https:\/\/tepcon.de\/en\/networking-between-mechanical-engineering-and-computer-science\/","title":{"rendered":"Networking between mechanical engineering and computer science"},"content":{"rendered":"<p>[et_pb_section fb_built=&#8221;1&#8243; module_class=&#8221;fpt0&#8243; _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_row _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;4_4&#8243; _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text admin_label=&#8221;1&#8243; module_id=&#8221;sectionscrollid1&#8243; _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;]<\/p>\n<h2>Our contribution to the Innovation Forum Smart Technologies &amp; Systems<\/h2>\n<p>On March 14, 2019, AP&amp;S International GmbH and tepcon GmbH, two sister companies from Donaueschingen-Aasen, presented their IoT developments and strategy to the audience at the Innovation Forum Smart Technologies and Systems in Donaueschingen. The forum, a cluster initiative of Technology Mountains e.V., IHK Schwarzwald-Baar-Heuberg and Hahn-Schickard, focused on innovative ideas, concepts and technologies from the fields of intelligent systems, sensor technology and additive manufacturing technologies. [\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8221;1&#8243; module_class=&#8221;bg_section_single_post&#8221; _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_row column_structure=&#8221;1_2,1_2&#8243; _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;1_2&#8243; _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text admin_label=&#8221;1&#8243; module_id=&#8221;sectionscrollid1&#8243; _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;]<\/p>\n<p>AP&amp;S and tepcon showed how a joint development between a machine manufacturer and a software company can lead to technology leadership in the market in the joint presentation &#8220;We make digitalization #tangible &#8211; for more efficiency in your company&#8221;.<\/p>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8221;1_2&#8243; _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_image src=&#8221;https:\/\/tepcon.de\/wp-content\/uploads\/2019\/03\/christoph_kluge_tepcon_digitalisierung_innovationsforum_163da6fc-1-1024&#215;663-1.jpg.avif&#8221; alt=&#8221;Our contribution to the Innovation Forum Smart Technologies &amp; Systems&#8221; module_class=&#8221;img__radius  &#8221; _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][\/et_pb_image][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8221;1&#8243; _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_row _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;4_4&#8243; _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text admin_label=&#8221;1&#8243; module_id=&#8221;sectionscrollid1&#8243; _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;]<\/p>\n<p>&#8220;We are a global supplier of wet process systems. Our entire IIoT concept is based on the solutions of our sister company tepcon. Networking the real and digital worlds significantly expands our possibilities and makes processes more efficient. We consistently apply this approach in all areas,&#8221; said Alexandra Laufer-M\u00fcller, Managing Director of AP&amp;S, at the start of the presentation.<\/p>\n<p>Christoph Kluge, Managing Director of tepcon, continued: &#8220;As a provider of software solutions for the B2B sector, we benefit greatly from the practical proximity to AP&amp;S. We don&#8217;t just sit in one building, we very often sit together at one table: everything that falls into the software area, whether directly in the machines or around them, we design together as efficiently and innovatively as possible right from the start. Decisive synergy effects here are an intensive exchange of ideas, practice-oriented solution development and rapid implementation. We successfully apply the experience and knowledge we gain through this collaboration to new projects with other machine manufacturers. Our aim is always to provide companies with unique selling points and thus competitive advantages with customized Industry 4.0 solutions. It has already worked really well for AP&amp;S: In 2018, the company won two important industry awards for innovative IoT solutions, including the Augmented Reality solution from tepcon, which is used in the sales and design process as well as in the areas of service, maintenance, documentation and after sales.&#8221;<\/p>\n<p>After the presentation, interested parties were able to discuss the topic in more detail with AP&amp;S and tepcon at a joint information stand.<\/p>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section]<\/p>\n","protected":false},"excerpt":{"rendered":"<p>The forum, a cluster initiative of Technology Mountains e.V., the&#8230;<\/p>\n","protected":false},"author":3,"featured_media":59245,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"","content-type":"","footnotes":""},"categories":[129],"tags":[178,179,180],"class_list":["post-59244","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-uncategorized","tag-innovations-forum","tag-mechanical-engineering","tag-networking"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Networking between mechanical engineering and computer science<\/title>\n<meta name=\"description\" content=\"Networking the real and digital worlds significantly expands our possibilities and makes processes more efficient.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, 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